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Sapphire Portable Diode Laser

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Overview

You can't afford to practice without it.

Compact. Easy-to-use. Affordable. The Sapphire Portable Diode Laser makes the benefits of laser dentistry available to more patients than ever before. Bring this powerful technolgy to your practice and experience the future today.

  • The ideal laser for both a first-time user and the seasoned dental laser practice.
  • 3 watts continuous wave output, with 5 watts peak pulse power, 808 nm wavelength.
  • Disposable tips - No stripping or cleaving.
  • Portable, with a long use battery.
  • Finger-touch control, with an optional foot pedal.

The Sapphire® Portable Diode Laser unit is a dental soft-tissue laser surgical/debridement device. The Sapphire Portable Diode Laser may be used for a variety of soft-tissue, gingival modification, and sulcular therapy procedures.

The Sapphire Portable Diode Laser is indicated for use in dental intraoral soft tissue general, oral maxilla-facial and cosmetic surgery including ablating, incising, excising, vaporizing and coagulation of soft tissues using a fiber optic delivery system. Indications include:

  • Excision and incision biopsies
  • Hemostatic assistance
  • Treatment of apthous ulcers
  • Gingival incision and excision
  • Gingivectomy
  • Gingivoplasty
  • Gingival troughing
  • Gingival recontouring
  • Tissue retraction for impressions
  • Oral papillectomy
  • Sulcular debridement
  • Sulcular tissue removal
  • Removal of granulation tissue
  • Frenectomy
  • Frenotomy
  • Abcess incision and draining and excision
  • Operculectomy
  • Removal of fibromas
  • Soft tissue crown lengthening
  • Vestibuloplasty

Instructions

The following instructions are relevant to Sapphire Portable Diode Laser and are available for download in PDF Format.

Instructions for the Sapphire Portable Diode Laser

You will need the Adobe Acrobat Reader to view these Files

Techniques

Gingival Contouring with the Sapphire® Portable Diode Laser:


Tip: Initiated
Mode: Continuous Wave
Power: 0.8 W
Anesthesia: Local, as required
Technique: Contact

After anesthesia is profound, insert a periodontal probe into
the sulcus down to the crest of the bone.


Measure that depth from the crest of the gingiva to the bone.
Note the reading and reduce it by 2.5 mm.


Make a stick mark in the facial gingiva at a point 2.5 mm
above the crest of the bone. Always leave 2.5 mm or more
of gingival tissue above the crest of the bone when performing
a soft tissue contouring procedure so as to not infringe upon the
biological width of the tooth.


Angle the tip slightly toward the incisal and make a series of
2-3 mm quick strokes with the fiber tip as you remove tissue and
establish the new line for the crestal gingiva.


Gingivectomy, Gingivoplasty and Papillectomy with the Sapphire Portable Diode Laser:


Tip: Initiated
Mode: Continuous Wave
Power: 1.0 W
Anesthesia: Local, as required
Technique: Contact

1. Using a periodontal probe, record the depth of the pocket
to be treated and evaluate its condition, either acute or
chronically inflamed.

2. If there is no apparent exudate present, use the periodontal
probe to define the height of contour that is to be establish.

3. With the patient anesthetized, carefully place a stick mark along
the facial aspect of the gingiva to create a reference for the
incision path.


4. With the Fiber Optic Tip angled slightly toward the occlusal or
incisal, remove the diseased tissue down to the previously
marked incision line.

5. If necessary to achieve desired results, increase power level
but always use the lowest amount of power necessary to reach
the treatment objectives and avoid charring tissue.

6. Taper and festoon the crestal gingiva as needed and then
quickly remove the diseased epithelium and restore
anatomical contour.


Note: Remember to avoid touching the root whenever possible and
move quickly while near the bone or root.

7. Flush the pocket using a warm saline solution or
hydrogen peroxide.

8. Record power settings used and treatment times in the
patient’s chart.


Gingival Troughing & Tissue Retraction for Impressions with Sapphire® Diode Portable Laser:


Tip: Initiated
Mode: Continuous Wave
Power: 0.8 W
Anesthesia: Topical or Local, as required
Technique: Contact

1. Following preparation of the tooth, cleanse the area (optional)
with H2O2 and then rinse with a light spray of water.

2. Air dry with low volume flow of air.

3. Lightly contact the sulcus lining just inside the crest of the
gingiva, angling the Tip away from the tooth.

4. Using very light pressure, begin lasing as you make small
paint brush-like strokes tracing the area of the tooth that needs
to be exposed or where the restoration margins are not
completely visible.


5. If necessary to achieve desired results, increase power level
but always use the lowest amount of power necessary to reach
the treatment objectives and avoid charring tissue.

6. Create a small trough between the tooth and gingiva. This will
allow you to achieve a high quality optical image, scan
or impression.

7. You may also choose to recontour abnormal gingival tissue
to achieve better esthetics in a fraction of the time with greater
precision for outstanding results.


Sulcular Debridement with the Sapphire Portable Diode Laser:


Tip: Initiated
Mode: Pulsed
Power: 0.8 W
Anesthesia: Topical or Local, as required
Technique: Contact
Time: 30 seconds
Technique: Contact

1. After conventional instrumentation has been completed, insert
the fiber tip to the full pocket depth.

2. Gently probe the pocket to get a sense of its geometry.

3. Begin lasing onto the diseased epithelial lining.

4. If necessary to achieve desired results, increase power level
but always use the lowest amount of power necessary to reach
the treatment objectives and avoid charring tissue.


5. Keep the Fiber Optic Tip parallel to the root surface or tilted
slightly toward the gingival tissue during treatment in order to
maximize ablation of the inflamed tissue.

6. While keeping the Fiber Optic Tip in contact with the epithelium,
move the Fiber Optic Tip in both horizontal and vertical directions,
covering the epithelium and adjacent inflammatory connective
tissue. Move the Tip smoothly and at a moderate speed.
Debride all granulation tissue.

• You may use a fine water spray during laser treatment for rinsing.

• Remove plume and debris with high volume evacuation.

• The total amount of time for this procedure is a function of the extent of the diseased soft tissue. In general, treat pockets 6 millimeters or less for approximately 30 seconds and pockets greater than 6 millimeters for 45 seconds.

• If the patient experiences noticeable discomfort, lower the power setting. Anesthetic may be administrated as required.


Labial Frenectomy with the Sapphire® Portable Diode Laser:


Tip: Initiated
Mode: Continuous Wave
Power: 1.0 W
Anesthesia: Local, as required
Technique: Contact

The procedures to relieve the frenum will differ for three basic areas: 1) Mandibular frenum – labial or buccal; 2)
Mandibular frenum – lingual (tongue-tied relief); 3) Maxillary frenum – labial and buccal.

Mandibular labial frenum attachments:

1. Place tension on the frenum by retracting the lip or cheek.

2. Beginning at the base of the attachment to the gingival tissue, make an
incision with the Sapphire Portable Diode Laser that is perpendicular to the
length of the frenum.


3. If necessary to achieve desired results, increase power level but always use
the lowest amount of power necessary to reach the treatment objectives and
avoid charring tissue.

4. Using continued tension, extend the incision until you are nearing the periosteum.

Note: Do not cut into or damage the periosteum.


5. The incision may need to extend laterally when there is a wide attachment.

6. Wipe the debris from the hard and soft tissues using hydrogen peroxide or
warm saline solution.

Note: Sutures are usually not required.


Lingual frenum:

Lingual frenum relief must be approached with caution to ensure that you do not inadvertently rupture or incise the rich vascular beds in the floor of the mouth and the inferior border of the tongue.

• Grasp the frenum with a hemostat near the attachment to the tongue and use a hemostat to protect the vascular complex as the incision is made and the frenum released. Maxillary labial frenum:

• Grasping the lip, place tension on the frenum and begin to make a perpendicular incision at the most coronal aspect of the attachment to the gingiva.

• With continued tension, release the frenum fibers as you are moving apically.

NOTE: Do not perforate or incise the periosteum.

Release all fibers down to the frenum attachment to the periosteum.

• A diamond shaped surgical area will indicate that you have released the attachment.

• Use warm saline rinses to clean the area.


Abcess Excision with the Sapphire Portable Diode Laser


Tip: Initiated
Mode: Continuous Wave
Power: 1.0 W
Anesthesia: Topical or Local, as required
Technique: Contact

1. Determine the status of the lesion, chronic or acute, and select a site to enter the parulis of the infection.

2. Based on the lesion status, enter the lesion by placing the fi ber tip at the most coronal spot on the parulis and with short strokes, make an incision to establish a drainage path.

3. Using high volume suction, irrigate the area with saline solution as the exudate appears.


4. Insert the tip into the incision site without emitting energy and lightly probe the area inside the parulis as you advance the tip apically.

5. Once you have established the base of the parulis, back the fi ber optic (therapy) tip out approximately 2 mm and activate the Sapphire Portable Laser as you slowly withdraw the tip.

6. Remove the tip briefl y and allow any exudate to drain.

7. After draining has slowed, re-enter the parulis and insert the Fiber Optic Tip just short of the base and then withdraw the Tip as the laser is activated.


8. Repeat the process until you have established a clear path for completing the remaining drainage.

9. Administer oral antibiotics as needed and give the patient instructions on using warm saline to cleanse and irrigate the oral environment.

10. If you are not able to complete the drainage procedure without pain, review basic protocols before administering a local anesthetic into the infected area.


Hemostasis with the Sapphire® Portable Diode Laser


Tip: Uninitiated
Mode: Continuous Wave
Power: 1.0 W
Anesthesia: Topical or as required
Technique: Non-Contact

Place the Fiber Optic Tip 2 mm above the gingival sulcus, in noncontact with tissue. Direct energy into sulcus and away from the dentin and cementum.

• Active the laser as you make a series of 2 – 3 mm strikes while circling the tooth. This should take about 30 – 40 seconds.

NOTE: Do not stop the movement of the fiber tip until you have reached the starting point again and do not contact the tissue.


• Examine the sulcus and see if you have hemostasis or if the ‘oozing’ has slowed.

• Repeat in 30 second intervals if hemorrhage persists.


• If bleeding continues after the second attempt, clean any excessive hemorrhage and lase for a third time. Do not exceed 11/2 minutes of lasing care.

NOTE: Continued bleeding indicates that you may have a larger arteriole that requires other hemostatic assistance in order to control.


Kit Options

Sapphire Portable Diode Laser

Product # Item  
033981000-0 Sapphire Portable Diode Laser
 Each complete packaged system is composed of the following items:
  • (1) Sapphire ST Portable Diode Laser unit
  • (1) Sapphire ST Portable Laser Handpiece
  • (3) Protective Glasses – Laser Safety appropriate for 808 nm 3W lasers
  • (5) Disposable, single-use 400µm Sapphire Portable Diode Laser Fiberoptic Tips, 5 pc package
  • (1) Auxiliary Power Supply
  • (1) Sapphire ST Portable Diode Laser Owner’s Manual
  • (1) Sapphire ST Portable Diode Laser Instructions for Use (IFU)
  • (1) Safety Sign
  • (1) Warranty Information
  • (1) System outer packaging
  • (1) Protective packaging insert(s) for portable unit and handpiece
  • (1) Disposable handpiece barrier sleeves, 25 pc

Warranty

SYSTEM WARRANTY

When used under normal operating conditions as described in this Manual, the Sapphire Portable Diode Laser system is warranted to be free of defects in materials and workmanship for one (1) year from the date of original shipment.

Within the warranty period, all parts and service charges for repairs to the Sapphire Portable Diode Laser system are covered by Den-Mat Holdings, LLC.

If service is required, the system must be returned to Den-Mat Holdings, LLC for diagnosis and repair. Contact your 1Call Representative for Return Authorization prior to shipping the System to Den-Mat Holdings, LLC. The Return Authorization will include a pick-up notice (Call Tag) for a common carrier to return the unit to Den-Mat Holdings, LLC. Freight charges for returns within the warranty period will be paid by Den-Mat Holdings, LLC. Freight charges for returns outside of the warranty period will be paid by the customer. The outside shipping container and any accompanying documents must be clearly marked “Repair Return.” Use only the original shipping container or other adequate shipping materials to protect the system in transit. Repairs may be made with new or refurbished parts, at the manufacturer’s discretion.

Returned units that are outside the Warranty period will be evaluated for the cause and extent of failure or damage by DenMat Holdings, LLC Service Representatives. Subject to the results of this evaluation, Den-Mat Holdings, LLC will contact the customer with a price quotation for the cost of repairs.

This is a limited warranty and the liability of Den-Mat Holdings, LLC is to repair or replace the system with new or refurbished parts. Den-Mat Holdings, LLC has no liability to refund any part of the purchase price and no liability for consequential damages, loss of profits, and damages to person or injury by reasons of any defects in said system from any cause whatsoever. Any buyer who purchases said system acknowledges their familiarity with the terms, conditions, and provisions of this limited warranty and purchases said system agreeing to such terms, conditions, and provisions.

Buyer purchases the Sapphire Portable Laser system from Den-Mat Holdings, LLC on the terms, conditions, and provisions of this limited warranty and waives all other rights and claims against Den-Mat Holdings, LLC for any damages or remedies exceeding said limited warranty.

EXTENDED WARRANTY

Within the first thirty (30) days following the date of original shipment of the Sapphire Portable Diode Laser, the purchaser is eligible to receive the Sapphire Portable Diode Laser Extended Warranty for additional cost. Contact your Den-Mat Holdings, LLC Sales Representative to learn about the System’s Extended Warranty.